Supermicro

Key Features 3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s Intel® C621A Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DI

Key Features 1. 200W High-efficiency Power Supply 80 PLUS, Gold Level Certified 2. Low noise level 3. 2x 2.5" hot-swap SAS/SATA HDD Bays 4. 1x Low-profile PCI expansion slot 5. 3x 8500 RPM Cooling Fan 6. Power Switch, Reset Button & 5 LED Indicators 7. Extra Compact Size roduct SKUs CSE-510T-203B SuperChassis 510T-203B (Black)

Supermicro assembled server based on AS-4124GQ-TNMI, 2x Milan 7763 CPU, 16x 32GB DDR4-3200, 2x SSD 2.5" NVMe PCIe4 960GB, 2x AOC-653106A-HDAT, SMC System Management, AOM-MCM-Q-P, 4x GPU MI250-128G-OAM Item Quantity AS -4124GQ-TNMI 2 PSE-MLN7763-0312 4 MEM-DR432L-HL02-ER32 32 HDS-MUN-MTFDKCC960TFR1BC 4 AOC-653106A-HDAT 4 AOM-MCM-Q-P 2 CBL

Delta Counter-Rotating Fan - 40 x 40 x 56mm Compatible with CSE-118G, CSE-818GTS, and CSE-218GHTS Series Chassis Fan Speed: 20,500 RPM / 17,600 RPM Supermicro Certified

Key Applications Data Center OptimizedDatabase Processing and StorageNetwork Appliance Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® Intel® DCPMM 2 PCIe 4.0 x16 (FHFL) slots, 2 PCIe 4.0 x8 (LP) slots Intel® Ethernet Controller X550 2x

Key Features - Embedded Networking Applications - Network Security Appliance - FireWall Applications - Virtualization Server 1. Intel® Atom® processor C3858, Single socket FCBGA 1310 2. System on Chip 3. 2 fixed 2.5" drive bays (top drive bay area share with AOC) 4. Up to 64GB Unbuffered ECC/non-ECC SO-DIMM, up to DD

Key Applications Enterprise ServerDatabase Processing & StorageAppliance Optimized Storage Key Features Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® Intel® DCPMM 2 PCIe 4.0 x16 (LP) slots, 2 PCIe 4.0 x8 (LP) slots Intel® Ethernet Controller X550

AS-1114S-WTRT Supermicro AS-1114S-WTRT 1U, 1xSocket SP3, TDP 240W, 8xDDR4, 10x2.5'' Hot-swap, 3xPCI-E 4.0 x16, 2xRJ45 10GBase-T, 1xRJ45 IPMI, 7xUSB 3.0, 1xVGA, 2x500W 1 100-000000049 AMD CPU EPYC 7002 Series 16C/32T Model 7302P (3/3.3GHz Max Boost,128MB, 155W, SP3) Tray 1 M393A8G40AB2-CWE Samsung DRAM 64GB DDR4 RDIMM 3200MHz, 1.2V, (4Gx4)

AS-1114S-WTRT Supermicro AS-1114S-WTRT 1U, 1xSocket SP3, TDP 240W, 8xDDR4, 10x2.5'' Hot-swap, 3xPCI-E 4.0 x16, 2xRJ45 10GBase-T, 1xRJ45 IPMI, 7xUSB 3.0, 1xVGA, 2x500W 1 100-000000049 AMD CPU EPYC 7002 Series 16C/32T Model 7302P (3/3.3GHz Max Boost,128MB, 155W, SP3) Tray 1 M393A8G40AB2-CWE Samsung DRAM 64GB DDR4 RDIMM 3200MHz, 1.2V, (4Gx4)

QUOTATION NO: 8600984349 OPTIMIZED 3U MicroCloud System, X12STE-F, CSE-939HN-R2K20BP SYS-530MT-H12TRF(x9)3U MicroCloud System, X12STE-F, CSE-939HN-R2K20BP(CQ8600984349) EXS16(x9)12% - 4 YRS EXT. WRNTY AFTER FIRST YR (SYSTEM ASSEMB. ORDER) Ext.WarrantyDiscount P4X-UPE2356G-SRKN2(x108)RKL-E E-2356G 1P 6C/12T 3.2G 12M 80W P750 H5 1200 B0 MEM

Key Features 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, 4 PCIe 5.0 x8 MCIO connectors M.2 Interface:

Key Features 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, 4 PCIe 5.0 x8 MCIO connectors M.2 Interface: