Supermicro

Key Features • Cloud and Virtualization needs • Compute Intensive Application • Database Processing and Storage • High Availability Storage • Hosting & Application Delivery 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM s

Key Features 1. 720W Redundant High-efficiency 80 PLUS Gold Level Power Supply 2. 8x 3.5" Hot-swap SAS / SATA Drive Bays 3. 2x Fixed 3.5" Drive Bays 4. Adjustable Air Shroud 5. 7x Low-profile, Full-length I/O Expansion Slot 6. 1x Serial, 2x USB Front Access I/O 7. Power Switch & 6 LED Indicators Please Note: Full SES2

Key Features   - IoT Gateway for Smart     Factory/Building/Home   - Kiosk, Interactive info system   - Environmental Monitor 1. Intel® Atom™ Processor E3940,     Single Socket FCBGA 1296 2. System-on-Chip 3. 1 Full size Mini-PCIe,     1 M.2 2280 B-Key for SATA or PCIe SSD 4. 1 non-ECC DDR3L SODIMM; up to 8GB 5. Dual GbE LAN ports

Key Features 1. Single socket H4 (LGA 1151) supports Intel® 7th/6th Gen. Core™ i7/i5/i3 series 2. Intel® B250 Express Chipset 3. Up to 64GB Non-ECC UDIMM, DDR4-2400MHz, in 4 DIMM slots 4. 1 GbE LAN port via Intel® i219V 5. 6 SATA3 (6Gbps) 6. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1 7. 1 PCIe 3.0 x4 M.2 (2280 form facto

Key Features 1. 700W Redundant Power Supplies 80 PLUS, Gold Level Certified 2. 8x 2.5" Hot-swap SAS / SATA Drive Bays 3. 1x Slim DVD-ROM Drive (optional) 4. 4x 4cm Counter-rotating PWM fans 5. 2x Full-height I/O Expansion slots & 1x Low-profile I/O Expansion slot 5. Supports motherboard sizes 12" x 13" E-ATX & 13.68"

CBL-SAST-0699 Supermicro SUPERMICRO 12Gb/s SFF-8643 to 4x SATA, 90/90/75/75cm w/ SB

Popis produktu: Product SKUs MBD-X10DRL-i -O X10DRL-i (Standard Retail Pack) MBD-X10DRL-i -B X10DRL-i (Bulk Pack) Physical Stats Form Factor ATX Dimensions 12" x 10" (30.48cm x 25.4cm) Processor/Cache CPU Intel® Xeon® processor E5-2600 v3 family (up to 145W TDP **) Dual Socket R3 (LGA 2011) Cores / Cache Up to 18 Cores / Up

Key Features 1. 700W Redundant Power Supplies Gold Level Certified 2. 4x 3.5" Hot-swap SAS / SATA Drive Bays 3. 1x Slim DVD-ROM Drive (optional) 4. 4x 4cm Counter-rotating PWM Fans 5. 2x Full-height I/O Expansion Slots & 1x Low-profile I/O Expansion Slot 6. Power Switch, Reset, UID Button & 5 LED Indicators 7. Full SES2

Chassis Manual Key Features 3U chassis - supports for maximum motherboard sizes: 13.68" x 13" E-ATX and ATX 16 x 3.5" hot-swap SAS/SATA drive bay with SES2, optional 2 x 2.5" hot-swap drive bay 16-port 3U SAS3 12Gbps single-expander backplane, support up to 16x 3.5-inch SAS3/SATA3 HDD/SSD 1U 800/1000W Redundant Titanium Single Output P

Key Features 1. 920W Redundant High-efficiency Platinum Level Power Supply 2. 2U High Density 2.5" HDD Chassis 24x 2.5" Hot-swap SAS/SATA HD bays 3. 6Gb/s SAS2 Expander 4. Mini-I-pass (SFF 8087) Connectivity for clean cable routing 5. 7x Low-profile Expansion Slot 6. Optional rear hot-plug 2x 2.5" HDD drive bays Produc

Key Features • Mainstream, Entry Appliance • Low Power, Cost effective 1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v5, Intel® 6th Gen. Core™ i3 series 2. Intel® C232 chipset 3. 1x 3.5" Fixed drive bay or 2x 2.5" drive option 4. Up to 64GB Unbuffered ECC UDIMM DDR4 2133MHz; 4x DIMM slots 5. 1x P

Key Features • Embedded, 7-year life cycle • Industrial Automation & Control • Military Compact Server • VOIP and Network Appliances • Medical Applications 1. Single socket H4 (LGA 1151) supports Intel® 6th Gen. Core i7/i5/i3 series, Intel® Celeron® and Intel® Pentium® processors 2. Intel® Q170 Express chipset 3. 2x 2.5" Fix