Supermicro

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot

Enclosure MBE-314E-420 (4x PWS) Server Blade Up to 14 hot-swap server blades Node Support Intel® based server blades LED Power LED, Fault LED GbE Switch / Pass-Through Module Up to 2 hot-swap MBM-GEM-001, MBM-GEM-003i, MBM-GEM-003s, MBM-GEM-004, MBM-XEM-001, or MBM-XEM-002 switches Management Module 1 hot-swap Chassis Management Mod

Key Features Intel® Xeon® Processor Skylake-W , Intel® Xeon® Processor W Family., Single Socket R4 (LGA 2066) supported, CPU TDP support Up to 140W Intel® C422 Up to 256GB Registered ECC RDIMM, DDR4-2666MHz; Up to 512GB Registered ECC LRDIMM, in 8 DIMM slots 3 PCI-E 3.0 x16, 1 PCI-E 3.0 x4***3xPCI-E3.0 x16 Slots(8/16/16 (Skylake-W 48 lan

Integrated System Only Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 4 DIMMs, 1 HDD/NVMe). Recommended configuration for best performance is at least 1 DIMM per channel per CPU (16 DIMM Total). Please contact your Supermicro sales rep for special requirements. Key Fe

Key Features 1. 650W Redundant Power Supply 2. 4x 3.5" Hot-swap SAS / SATA Drive Bays 3. 1x Slim DVD-ROM Drive 4. 4x 4cm Counter-rotating PWM Fans 5. 1x Full-height Universal I/O (UIO Expansion Slot) 6. 1x Full-height, Full-length I/O Expansion Slot 7. 1x Low-profile I/O Expansion Slot 8. Power Switch, Reset, UID Button &

Key Features 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 slots, support 5 low-profile AOCs 4. 8x 2.5" SAS3 & 8x 2.5" SATA3 Hot-swap Drive Bays, optional DVD-ROM drive,

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot

Key Features 2U chassis supports for maximum motherboard sizes - EE-ATX 13.68" x 13", E-ATX 12" x 13", ATX 12" x 10" motherboards 3 x 3.5" hot-swap SAS/SATA drive bay with SGPIO, optional 2 x 2.5" hot-swap SAS/SATA drive bay w/ full SES-II support on SAS motherboards 3-port SC825M SAS3 12Gbps TQ backplane, support up to 3x 3.5-inch SAS3/

Key Features - Corporate Database - Database Processing & Storage - Enterprise Server - HPC, Data Center - iSCSI SAN 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 4. 24 Hot

Key Features • Web Hosting, VM • Cloud Computing • Connectivity/Storage Computer Nodes 1. Single AMD EPYC™ 7000-Series Processor 2. Up to 1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs 3. 1 PCI-E 3.0 x16 (FH/HL) slot 4. Integrated IPMI 2.0 + KVM with dedicated LAN 5. 2x 1GbE LAN ports via Intel® I210 6. 4 hot-swap 3.5" SATA3 dr

Key Features • Web Server, Firewall Apps. • Corporate-Wins, DNS, Print, Login • Gateway, provisioning servers • Compact Network Appliance • Cloud Computing 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 2 PCI-E