Supermicro

Key Features • General Purpose, SMB, Web Hosting • Application and data serving • Archiving, Mail/Finance, Security 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB ECC UDIMM, up to DDR4-2666M

Key Features - Supports up to 3 GPUs in 1U - Support Passive GPUs - 2D/3D and CAD Applications - Astrophysics, Chemistry - Cloud and Virtualization 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.

Key Features • High Density Storage • Object Storage 1U • Scale-out Storage • Ceph / Hadoop • Big Data Analytics 1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 1.5TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 12 DIMM slots 3. 2 PCI-E 3.0 x16 slots, 1 PCI-E 3.0 x16 LP slot, 1 PCI-E 3.0 x4 NVMe M.2

Key Features 8th/9th Generation Intel® Core?i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor., Single Socket LGA-1151 (Socket H4) supported, CPU TDP support Up to 95W TDP Intel® C242 chipset Up to 128GB DDR4 2666MHz ECC UDIMM; 4 DIMM slots Expansion slots: 1 PCI-E 3.0 x8 (in x16), 2 PCI-E 3.0

Key Features • Entry-Level Workstation • Designed for CAD and 3D Modeling Applications • NVIDIA® Quadro® Professional GPU Support 1. Single socket H4 (LGA 1151) supports Intel® Xeon® E processor, 8th/9th Gen. Intel® Core™ i9/i7/i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 64GB ECC/non

8th/9th Generation Intel® Core™ i9/Core™ i7/Core™i5/Core™i3/Pentium®/Celeron® Processor, Intel® Xeon® E-2100 Processor, Intel® Xeon® E-2200 Processor Single Socket LGA-1151 (Socket H4) supported, CPU TDP support Up to 95W TDP Intel® C246 Up to 128GB Unbuffered ECC/non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1

Key Features 1. Dual Socket P (LGA 3647) support Intel® Xeon® Scalable Processors 2. Up to 2TB 3DS ECC LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots, M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 4. 2x 1GbE L

Key Features • HA, High flexibility, VM, Communication • Application and data serving • Appliance Server 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100, 8th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C246 chipset 3. Up to 128GB ECC UDIMM, up to DDR4-2666MHz; 4 DIMM

Key Features • Quad SFP+ Connectors • Super I/O Module (SIOM) Form Factor • Network Virtualization Offloads including VXLAN and NVGRE • Small Packet Performance • Data Plane Developer Kit for efficient packet processing • Low Power Consumption • Intel® Flow Director • Intelligent Offloads • Unified networking providing a single wire sup

Key Features • Virtual Router • FireWall Applications • Virtualization • Low Power, Low Cost Applications 1. Intel® Atom® processor C3850, Single socket FCBGA 1310; TDP 25W TDP 25W 2. 1x 3.5" or 4x 2.5" internal drive bays 3. 1 PCI-E 3.0 x4, 1 mini PCIe with mSATA support (half card only) 4. Up to 64GB Unbuffered ECC/non-ECC

Key Features • Network Security Appliance • Edge Computing Server • Virtualization Server 1. Intel® Atom® processor C3758, Single socket FCBGA 1310; 8-Core, TDP 25W 2. 1x 3.5" or 4x 2.5" internal drive bays 3. 1 PCI-E 3.0 x4, 1 M.2 (M key for SSD, 2242/2280, PCI-E 3.0 x2 or SATA3) 4. Up to 256GB ECC RDIMM DDR4 2400MHz or

Key Features • Connectivity/Storage Compute Nodes • Database Processing & Storage Appliance Platform 1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10