Supermicro

Key Features 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Intel® Xeon® W-32xx Processor Single Socket LGA-3647 (Socket P) supported, CPU TDP support 205W TDP Intel® C621 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots; Xeon-W 32x

Key Features ? SDN-WAN, vCPE controller box ? NFV Edge Computing Server ? Virtualization Server ? FireWall Applications ? IoT Edge Computing 1. Intel® Xeon® processor D-2146NT, 8-Core, 16 Threads, 80W 2. System on Chip 3. 4x 7mm SSD 4. 1 M.2 slot M key for SSD, 2242/80, 1 M.2 B Key for SSD/ WAN card, 1 Mini-PCI-E with mSATA Su

Key Features ? Appliance Server ? Security/Gateway Server ? Edge Computing 1. Single Socket H4 (LGA 1151) supports Intel® Xeon® processor E-2100 / E-2200 series, 8th/9th Gen. Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium® 2. Intel® C242 chipset 3. Up to 64GB ECC UDIMM, up to DDR4-2666MHz; 2 DIMM slots 4.

Key Features ? Virtualization ? Cloud Computing ? High End Enterprise Server 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 slots (FH, 10.5" L), 2 PCI-E 3.0

ey Features ? DB Processing & Storage ? Data Center Applications ? Firewall Applications 1. Single AMD EPYC™ 7002 Series Processor 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. 2 PCI-E 4.0 x16 (FHFL) slots, 1 PCI-E 4.0* x16 (LP) slot 4. Integrated IPMI 2.0 + KVM with? dedicated LAN • Software Out of Band Lic

Key Applications - DB Processing & Storage - Data Center Applications - Firewall Applications Key Features 1. Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP)

Key Features 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 slots, support 5 low-profile AOCs 4. 8x 2.5" SAS3 & 8x 2.5" SATA3 Hot-swap D

Key Features Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C621 Chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots Expansion slots: 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 2 GbE LAN ports 8 SATA3 (6Gbps) ports I/O: 1 VGA, 2 COM, TPM header 2

Key Features ? Cloud and Virtualization needs ? Connectivity/Storage ??Computer Nodes ? Database Processing & Storage ? High End Enterprise Server ? Hosting & Application delivery 1.Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.1TB Registered ECC DDR4 2666MHz SDRAM in 8

Key Features ? Backup Storage ? Web or Database Servers ? Compact Network Appliance 1.Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required) 3.Expansi