Servery - Barebone

Key Features ? Cloud and Virtualization needs ? Connectivity/Storage ??Computer Nodes ? Database Processing & Storage ? High End Enterprise Server ? Hosting & Application delivery 1.Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.1TB Registered ECC DDR4 2666MHz SDRAM in 8

pecifications Processor / System Bus 2 x Socket SP3 AMD EPYC™ 7000 Series AMD EPYC™ 7002 Series *Refer to support page for more information Generation E9 Memory Total Slots : 32 (8-channel per CPU, 16 DIMM per CPU) Capacity : Maximum up to 4096GB LR-DIMM 3DS Memory Type : DDR4 2666/2400 /2133 RDIMM DDR4 2666/2400 /2133 LRDIMM DDR4 2666/24

Key Features - Compute Intensive Applications - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Single AMD EPYC™ 7002 Series Processor 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 8 DIMM slots 3. 2 PCI-E 4.0 x16 (LP) slots 4.

2U1S 26 SATA Storage Server 18 2.5" SATA + 8 2.5" drive bays (for HBA/RAID) PCIe x16 OCP v2.0 LAN mezzanine slot (Type 1) 4 FH/FL + 1 HH/HL PCIe x8 slots 2 NVMe/SATA M.2 ports for boot drives SAS support with 3rdparty SAS HBA/RAID Tyan Transport SX TN70AB8026 (B8026T70AV26HR-LE) Specifications System Form Factor 2U Rackmount Chassis M

Key Features ? Web Hosting, VM ? Compact Network Appliance 1. Single Socket P (LGA 3647) supports 2nd Gen. Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 1 PCI-E 3.0 x16 slot (FH, HL) 4. 4 Hot-swap 3.5" SATA3 bays w/ RAI

Key Features ? DB Processing & Storage ? Data Center Applications ? Firewall Applications 1. Single AMD EPYC™ 7002 Series Processor 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM 3. 2 PCI-E 4.0 x16 (FHFL) slots, 1 PCI-E 4.0* x16 (LP) slot 4. Integrated IPMI 2.0 + KVM with? dedicated LAN • Software Out of Band Li

Key Features • Mainstream, Entry Appliance • Low Power, Cost effective 1. Single socket H4 (LGA 1151) supports Intel® Xeon® processor E3-1200 v5, Intel® 6th Gen. Core™ i3 series 2. Intel® C232 chipset 3. 1x 3.5" Fixed drive bay or 2x 2.5" drive option 4. Up to 64GB Unbuffered ECC UDIMM DDR4 2133MHz; 4x DIMM slots 5. 1x P

Key Features ? Cost Effective 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 8 Hot-swap 3.5" SATA3 drive bays; RAID 0, 1, 5, 10 5.

Key Features - Supports up to 4 NVIDIA® GPUs in 1U - Support Active/Passive GPUs - GPU health monitoring with Fan speed control 1. Dual Socket P (LGA 3647) support 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™

Redundantný napájací zdroj 730W pre skrinku SC-5300

Key Features ? DB Processing & Storage ? Data Center Applications 1. Single Socket P (LGA 3647) supports 2nd Gen. Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot 4. 10 Hot-swap 2.5" SATA3 drive b

Key Features - Embedded Security Appliance - Embedded IoT Gateway - Networking Edge Device 1. Intel® Atom® processor C3558, Single socket FCBGA 1310 2. System on Chip 3. 1 fixed 2.5" drive bay (Top drive bay area is shared with AOC. Please remove riser card when installing 2.5" drive on the top.) 4. Up to 256GB reg