Servery, storage

CPU Support Intel Core 12th -15th Gen CPU Socket LGA 1851/1700 Screw Type M3 Installation Torque 5-7 in-lb Weight 515.2g Material Copper Base & Aluminum Fins with Heat Pipe embedded Solution 2U Server and Up Dimensions 90.7 x 85.0 x 65.1 mm Fan Dimension 60 x 60 x 25 mm Rated Voltage 12V Bearing 2 Ball Bearing Speed

CPU Support Intel® Alder Lake S ProcessorIntel Core 12th -15th Gen CPU Socket LGA 1851/1700 Screw Type M3 Installation Torque 5-7 in-lb Solution 1U Server Dimensions 90.0 x 90.0 x 27 mm Weight 490 ± 5 g Material Copper Heat Sink with Skiving Fins Thermal Grease Pre-Printed with SHIN-ETSU 7762 or Equivalent Life – Continu

GENERAL DATA CPU Sockets AMD® Socket AM4 TDP up to 95 Watts Solution 1U Server Cooling type active Material Copper Heatsink Fan Dimensions Ř 70 x 15mm Rated Voltage 12V Bearing 2 Ball Bearing Fan Speed At 20%: 1100 ± 200 RPM At 50%: 2600 ± 10% RPM At 100%: 6000 ± 10% RPM Fan Power At 20%: 0.60 Watts At 50%: 1.20 Watts At 100%: 8.80 Watts

GENERAL DATA CPU Sockets Intel® Socket LGA 1700 TDP up to 125 Watts Solution 1U Server Cooling type active Material Copper Heatsink with Skiving Fins Fan Dimensions Ř 80 x 15mm Rated Voltage 12V Bearing 2 Ball Bearing Fan Speed At 0~20%: 1000 ± 200 RPM At 50%: 3500 ± 10% RPM At 100%: 7000 RPM Fan Power At 0~20%: 0.60 Watts At 50%: 3.84 Wa

Vysoko spoľahlivý výkon s vylepšeným ukladaním do vyrovnávacej pamäte, čo z neho robí logickú voľbu pre cloudové dátové centrum a rozsiahle aplikácie dátových centier Inovatívna konštrukcia pohonu s použitím hélia. Optimalizované pre vysoký výkon, bezpečnosť a maximálnu úsporu. Exos X sú vyladené pre veľké prenosy údajov a nízku latenciu.

GENERAL DATA CPU Sockets AMD® Socket AM4/ AM5 TDP up to 120 Watts Solution 2U Server Cooling type active Material Aluminum heatsink with heatpipe embedded Fan Dimensions Ř 60 x 28mm Rated Voltage 12V Bearing 2 Ball Bearing Fan Speed At 20%: 1500 ± 10% RPM At 50%: 3500 ± 10% RPM At 100%: 7000 RPM Fan Power At 20%: 0.60 Watts At 50%: 2.16 W

Features CPU socket Type TDP Material Thermal paste Intel® socket LGA1700 1U Active up to 150 Watt Copper with VC Base Shin-Etsu 7762 Pre-printed Technical Data Fan size Bearing Voltage Power Fan speed Air Flow Air pressure Noise level 80 x 80 x 13 mm 2 ball bearing 12V at 20%: 1.08 W at 50%: 4.70 W at 100%: 26.40 W at 0~20%

MOTHERBOARD Form factor Mini ITX, mATX, µATX, ATX, eATX, SSI EEB max. Motherboard size 305mm x 355mm (12" x 13.9") INSTALLATION DIMENSIONS Height CPU cooler (max.) 145mm Length graphics card (max.) 320mm DRIVE BAYS 5.25" external 3xą 3.5" external 3.5" internal 10xą 2.5" internal ą can vary by using several mounting options FRONT CONN