Servery, storage

Technical Specification Drive Configuration Device Location: Internal Form Factor: U.2 Storage Capacity: 15.36 TB Supports Data Channel: PCIe NVMe 3.0 x4 Memory Technology: NAND Flash Flash Memory Cell Technology: Triple-Level Cell External Colour: Black Performance Maximum Random Read Rate: 850000 IOPS Maximum Random Write Rate: 150000 I

Lokace zřízení: Interná Forma: 3.5" Úložná kapacita: 10 TB Podpora dátového kanála: SATA III-600 Instalováná cache paměť: 256 MB Maximální kapacita sektoru: 512 B Performance Rýchlosť otáčania: 7200 rpm Přístupová doba: 8 ms Maximum Seek Time: 8.6 ms Sustained External Data Bit Rate: 6 Gbps Reliability Non-Recoverable Errors:

32GB DDR4 2666MT/s ECC Registered DIMM DDR4 2666MT/s ECC Registered DIMM CL19 2RX4 1.2V 288-pin 8Gbit Hynix D IDT * poznámka: označenie MHz je totožné s označením MT/s, ktoré je používané ako nové označenie prenosu dátovej rýchlosti.

DDR4 ... 16GB .......2666MHz ..ECC reg DIMM CL19.....Kingston * poznámka: označenie MHz je totožné s označením MT/s, ktoré je používané ako nové označenie prenosu dátovej rýchlosti.

R182-Z92 Dual AMD EPYC 7002, 32 x DIMMs, 2 x 1Gb/s LAN, 10 x 2.5" NVMe SSD bays, Ultra-Fast M.2 with PCIe Gen3 x4, 2 x PCIe Gen4 x16, 1 x OCP 3.0 Gen4 x16, 1 x OCP 2.0 Gen3 x8, 1200W 80 PLUS Platinum

Key Features ? Cloud and Virtualization needs ? Connectivity/Storage ??Computer Nodes ? Database Processing & Storage ? High End Enterprise Server ? Hosting & Application delivery 1.Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.1TB Registered ECC DDR4 2666MHz SDRAM in 8

2U1S 26 SATA Storage Server 18 2.5" SATA + 8 2.5" drive bays (for HBA/RAID) PCIe x16 OCP v2.0 LAN mezzanine slot (Type 1) 4 FH/FL + 1 HH/HL PCIe x8 slots 2 NVMe/SATA M.2 ports for boot drives SAS support with 3rdparty SAS HBA/RAID Tyan Transport SX TN70AB8026 (B8026T70AV26HR-LE) Specifications System Form Factor 2U Rackmount Chassis M

Managing the photos and videos on your mobile devices is becoming increasingly complicated. As technology evolves, files increase in size and number. With Apollo Cloud, you can store and share these memories both safely and privately. Easy to Use Setup takes just minutes, and Apollo Cloud is accessible from any device. Quickly access pe

TYAN TS75AB8252 (B8252T75AV18E8HR-2T) Specifications System Form Factor 2U Rackmount Chassis Model TS75A Dimension (D x W x H) 29.53" x 17.24" x 3.45" (750 x 438 x 87.6mm) Motherboard Name S8252GM2NE-2T Motherboard Notification # The motherboard not sold separately Gross Weight 30 kg (66 lbs) Net weight 19 kg (42 lbs) Front Panel Button

Key Features ? Backup Storage ? Web or Database Servers ? Compact Network Appliance 1.Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required) 3.Expansi

pecifications Processor / System Bus 2 x Socket SP3 AMD EPYC™ 7000 Series AMD EPYC™ 7002 Series *Refer to support page for more information Generation E9 Memory Total Slots : 32 (8-channel per CPU, 16 DIMM per CPU) Capacity : Maximum up to 4096GB LR-DIMM 3DS Memory Type : DDR4 2666/2400 /2133 RDIMM DDR4 2666/2400 /2133 LRDIMM DDR4 2666/24