Pre servery a workstation

Intel® W790 (LGA 4677) CEB workstation motherboard, PCIe 5.0 x16, M.2, 10G and 2.5G LAN, Server-grade Remote Management, 12+1+1 power stages, front and Rear USB 3.2 Gen 2x2 Type-C® Intel® LGA 4677 socket: Ready for Intel Xeon® W-3400 & W-2400 processors CPU and memory overclocking: Supports for up to 2TB of ECC R-DIMM DDR5 memory (2DPC) U

Intel® W790 (LGA 4677) EEB workstation motherboard, PCIe 5.0 x16, M.2, Dual 10G LAN, Server-grade Remote Management, 14+1+1 power stages, USB 3.2 Gen 2x2 Type-C® Intel® LGA 4677 socket: Ready for Intel Xeon® W-3400 & W-2400 processors CPU and memory overclocking: Supports for up to 2TB of ECC R-DIMM DDR5 memory (1DPC) Ultrafast connectivi

Key Features AMD EPYC™ 9004 series Processors System on Chip Up to 3TB 3DS ECC RDIMM, DDR5-4800MHz in 12 DIMM slots 3 PCIe 5.0 x16 2 PCIe 5.0 x8 2x 10GBase-T LAN Ports via Broadcom BCM57416 Up to 6 USB 3.0 ports(4 rear + 2 via header) 8 SATA3 ASPEED AST2600 BMC graphics 6 PWM 4-pin Fans with tachometer status monitoring M.2 Interface: 2 P

Key Features 14th/13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processors, Single Socket LGA-1700 supported, Up to 150W TDP Intel® W680 192GB Unbuffered ECC/non-ECC UDIMM, DDR5-4400MT/s, 4 DIMM Slots 2 PCIe 5.0 x16 slots (16/NA or 8/8), 2 PCIe 3.0 x4 1 5V PCI 32bit M.2 Interface: 3 PCIe 4.0 x4 (RAID 0, 1, 5) M.2 Form Factor: 2280 M.2 Key: M-Key

Supermicro main board server MBD-H12DSi-NT6-B, Dual AMD EPYC 7003/7002 Series CPUs, 10 SATA3, 2 SATADOM, 4 NVMe, Dual 10GBase-T LAN ports, 1 dedicated IPMI LAN Port, 8x 4-pin PWM Fans & Speed control Technical Specification Procesor Chipset: System on Chip (SoC) CPU SECC standart: Socket SP3 Supports Central Processor Unit: AMD EPYC 7002

Intel® Xeon® Processor D-2123IT, CPU TDP support Up to 60W TDP System on Chip Up to 256GB Registered ECC RDIMM, DDR4-2133MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2133MHz, in 4 DIMM slots 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x16 1 Mini-PCI-E, 2 PCI-E 3.0 NVMe x4 Internal Port(s) 1 M.2 M-Key SATA/PCI-E 3.0 x4, 2280 1 M.2 B-Key SATA/PCI-E 3.0 x2, 3042 U.

Key Features 1.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2.4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 3.Expansion slots: 3 PCI-E 4.0 x16 slots, 3 PCI-E 4.0 x8 slots M.2 Interface: 1 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22

Key Features Intel® Xeon® E-2300 Processor, 10th Generation Intel® Pentium® Processor, Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 95W TDP Intel® C256 Up to 128GB Unbuffered ECC UDIMM, DDR4-3200MHz 1 PCIe 4.0 x16 Left Riser Slot 1 PCIe 3.0 x4 (in x8, Right Riser slot) M.2 Interface: 1 PCIe 4.0 x4 and 1 PCIe 3.0 x

Key Features Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C621 Chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots Expansion slots: 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 2 GbE LAN ports 8 SATA3 (6Gbps) ports I/O: 1 VGA, 2 COM, TPM header 2

Supermicro main board server MBD-H12DSi-NT6-B, Dual AMD EPYC 7003/7002 Series CPUs, 10 SATA3, 2 SATADOM, 4 NVMe, Dual 10GBase-T LAN ports, 1 dedicated IPMI LAN Port, 8x 4-pin PWM Fans & Speed control Technical Specification Procesor Chipset: System on Chip (SoC) CPU SECC standart: Socket SP3 Supports Central Processor Unit: AMD EPYC 7002

Key Features 10th Generation Intel® Core™ i9/Core™ i7/Core™ i5/Core™ i3/Pentium®/Celeron® Processor, 11th Generation Intel® Core™ i5/i7/i9 Processors, Intel® Xeon® W-1200 Processors, Intel® Xeon® W-1300 Processors Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 125W TDP Intel® W580 Single LAN with Intel® Ethernet i225