Základné dosky

ASUS TUF GAMING X670E-PLUS WIFI preberá všetky základné prvky najnovších procesorov AMD Ryzen série 7000 a kombinuje ich s funkciami pripravenými na hru a overenou odolnosťou. Táto základná doska, navrhnutá s komponentmi vojenskej kvality, vylepšeným riešením napájania a komplexným chladiacim systémom, presahuje očakávania so skalopevným

Key Features Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W Intel® C621 Chipset Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots Expansion slots: 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 2 GbE LAN ports 8 SATA3 (6Gbps) ports I/O: 1 VGA, 2 COM, TPM header 2

Výhody Supports AMD Ryzen 3rd Gen (Matisse/ Renoir) and 4th Gen (Vermeer) processors AMD B550 single chip architecture Supports 4-DIMM DDR4-4933+(OC)/4800(OC)/4600(OC)/4400(OC)/4000(OC)/3800(OC)/3600(OC) /3200/2933/2667/2400/2133/1866 up to 128GB maximum capacity Supports USB 3.2 Gen2 Supports PCIe M.2 4.0 (64Gb/s) Supports HDMI 2.1

Supermicro main board server MBD-H12DSi-NT6-B, Dual AMD EPYC 7003/7002 Series CPUs, 10 SATA3, 2 SATADOM, 4 NVMe, Dual 10GBase-T LAN ports, 1 dedicated IPMI LAN Port, 8x 4-pin PWM Fans & Speed control Technical Specification Procesor Chipset: System on Chip (SoC) CPU SECC standart: Socket SP3 Supports Central Processor Unit: AMD EPYC 7002

Key Features 10th Generation Intel® Core™ i9/Core™ i7/Core™ i5/Core™ i3/Pentium®/Celeron® Processor, 11th Generation Intel® Core™ i5/i7/i9 Processors, Intel® Xeon® W-1200 Processors, Intel® Xeon® W-1300 Processors Single Socket LGA-1200 (Socket H5) supported, CPU TDP supports Up to 125W TDP Intel® W580 Single LAN with Intel® Ethernet i225

Rozširujúca karta ASUS ThunderboltEX 4, dva porty Thunderbolt™ 4 (USB-C®), DisplayPort™ 1.4, rozhranie PCIe® 3.0 x4 Prídavná karta Thunderbolt™ 4 s certifikáciou Intel® Obojsmerná šírka pásma 40 Gbps pre superrýchle prenosy dát a video výstup Dva porty Thunderbolt™ 4 (USB-C®) s podporou až piatich zariadení Thunderbolt v reťazci DisplayPo

Key Features 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory, in 8 DIMM slots 1 PCI-E 4.0 x16, 2 PCI-E 4.0 NVMe x8 Internal Port(s) M.

Supermicro mainboard server MBD-H12SSL-NT-O, Single AMD EPYC 7002 Series CPU 2TB Registered ECC DDR4, 8 DIMMs 5 PCI-E 4.0 x16 2 PCI-E 4.0 x8 2 M.2, 2 SlimSAS x8, Dual 10GBase-T LAN via Broadcom BCM57416 Procesor Chipset: System on Chip (SoC) CPU SECC standart: Socket SP3 Supports Central Processor Unit: AMD EPYC 7002 Series Processors CP

Key Features 1.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2.4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 3.Expansion slots: 3 PCI-E 4.0 x16 slots, 3 PCI-E 4.0 x8 slots M.2 Interface: 1 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22

Key Features 3rd Gen Intel® Xeon® Scalable processors Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s Intel® C621A Up to 2TB RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots 4 PCI-E 4.0 x16 M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280/22110, 2280 M.2 Key

Procesor Chipset: AMD WRX80 Supports Central Processor Unit: AMD Ryzen Threadripper Pro 3000WX CPU Maximum Quantity Supports: 1 Main Board Server - Memory Typ pamäte: DDR4 SDRAM Obsahuje ECC: Non-ECC/ECC Frekvencia pamäte: 2133MHz(PC4-17000) 2400MHz(PC4-19200) 2666MHz(PC4-21300) 2800MHz(PC4-22400) 2933MHz(PC4-23400) 3000MHz(PC4-24000) 32

Key Features 12th Generation Intel® Core™ i3/i5/i7/i9 Processors, Single Socket LGA-1700 supported, CPU TDP supports Up to 125W TDP Intel® W680 Single LAN with Intel® Ethernet i225LM Single LAN with Intel® PHY I219LM LAN controller for AMT/vPro Single LAN with RTL8211 Dedicated LAN for IPMI 2 PCI-E 5.0 x16 slots (16/NA or 8/8)2 PCI-E 3.0